Multi Beam Sputter Deposition Systems

Sep 7, 2016 | Products

Our answer to the demand for higher throughput in multicomponent materials research: multi beam sputter deposition. A unique geometry for thin film deposition based on ion beam sputtering, with multiple ion beams generated by our ultracompact and ultralow power ECR technology. A key feature is the possibility to depose uniformly in composition and thickness, or with controlled gradients, across stationary substrates, using very compact sputter targets. All in a highly automated system with a very small footprint.

Ion beam deposition ‘the easy way’

Systems for ion beam deposition are generally considered to be bulky and complicated. With our multi beam deposition systems we we try to break with this idea. We believe that due to the completely different concept of our systems, ion beam deposition can now be done ‘the easy way’.


Tunable deposition parameters

Stable ion beams in a large current & energy window


Easy system operation

Inherently reliable ion source type plus accessible user interface


Low system maintenance

Patented design to protect sources & chamber from deposition

Launch a recipe and have the system deposit thin films of almost any solid target material, based on up to 12 (or 24, depending on the number of sources) individual targets. Reactive depositions, for e.g. nitride or oxide thin films, are also possible. Substrates can be of sensitive nature, as they are not attacked by plasma (plasma is confined to the source cavities). Substrate loading is through the top opening and is customized. Standard is uniform film thickness deposition on stationary 4 inch substrates. But the target block can be adapted in size and angle to vary the maximum area that can be deposited with uniform thickness without sample rotation.

  • 12 or 24 ion sources
  • 3-10kV ion energy
  • recipe depositions
  • up to 200 nm/h
  • Ø 4 inch substrates
  • fully isolated from the plasma
  • no substrate bias
  • low substrate heating
  • Dense & smooth films
  • Nanocrystalline films
  • Semi-conformal deposit
  • No noble gas inclusion

Multi-component thin films in many varieties

The source technology employed in these deposition systems offers enormous possibilities for multi-component thin films. This is, first of all, because our ECR ion sources have a large operating window both beam current and energy. Secondly, each source is controlled individually through individual RF power supplies. And finally, the sources are easy to turn on and off individually. This enables the uniform deposition of multi-component materials, but also the controlled deposition of nonuniform multi-component materials. Nonuniform compositions across a substrate can be of interest for combinatorial thin film synthesis, aiming at rapid material discovery. A nonuniform composition in vertical sense can be useful for better adhesion of a film on a substrate, but for example also to create a continuously varying refractive index.


Deposition of alloys & compounds

controlled stoichiometry for the full composition range


Functionally graded thin films

Vary the deposition rate and/or energy of individual sources during the process


Multilayer deposition

Compile multilayer films by turning sources on and off individually

Multi Beam Sputter Deposition in action